NEC 2023 · Article 250

NEC Article 250 — Grounding & Bonding

Article 250 covers grounding of electrical systems, equipment grounding, bonding of metal piping and structural steel, and the sizing of grounding and bonding conductors. Correct grounding protects people and equipment; incorrect grounding is a leading cause of failed inspections and re-work.

Grounding Electrode System — 250.50

All electrodes present at the building or structure shall be bonded together to form a grounding electrode system. When none of the listed electrodes are present, one or more of the manufactured electrodes below must be installed.

Electrode TypeRequirements / Notes
Metal underground water pipeMust be in contact with earth ≥ 10 ft. Must supplement with additional electrode (250.53(D)(2)).
Metal in-ground support structure (building/structure frame)Effectively grounded structural steel in direct contact with earth or encased in concrete in contact with earth.
Concrete-encased electrode (Ufer ground)≥ 20 ft of bare or zinc-coated steel rebar, ½" minimum, or ≥ 20 ft of AWG 4 copper encased in concrete.
Ground ringBare copper conductor, AWG 2 minimum, at least 20 ft, buried ≥ 30 in below grade, encircling building.
Rod and pipe electrodes8 ft minimum length, ⅝" diameter solid/pipe. If single rod < 25 Ω, supplement required.
Plate electrodeEach plate must expose ≥ 2 sq ft of surface to exterior soil. Iron/steel ≥ 0.25" thick; nonferrous ≥ 0.060" thick.
Other listed electrodesChemical, cell-type, and listed manufactured electrodes per manufacturer and listing.

Grounding Electrode Conductor Sizing — Table 250.66

Minimum GEC size based on the largest ungrounded service-entrance conductor or equivalent area for parallel conductors. AWG unless otherwise noted.

Largest Ungrounded SE ConductorCopper GECAluminum GEC
AWG 2 or smaller86
AWG 1 or 1/064
AWG 2/0 or 3/042
AWG Over 3/0 through 350 kcmil21/0
AWG Over 350 through 600 kcmil1/03/0
AWG Over 600 through 1100 kcmil2/04/0
AWG Over 1100 kcmil3/0250 kcmil

Equipment Grounding Conductor Sizing — Table 250.122

Minimum EGC size based on the rating of the overcurrent protective device ahead of the circuit. Where conductors are larger than required for ampacity, EGC must be increased proportionally (250.122(B)). AWG unless noted.

OCPD Rating (A)Copper EGCAluminum EGC
151412
201210
30108
40108
60108
10086
20064
30042
40031
50021/0
60012/0
8001/03/0
10002/04/0
12003/0250 kcmil
16004/0350 kcmil
2000250 kcmil400 kcmil

Key Bonding Requirements

  • Interior metal water piping (250.104(A)): Must be bonded to the grounding electrode system or grounded service equipment enclosure using a conductor sized per Table 250.122.
  • Gas piping (250.104(B)): Exposed metal gas piping shall be bonded to the grounding electrode system. Sizing: minimum 10 AWG copper.
  • Structural steel (250.104(C)): Exposed structural metal forming a building frame shall be bonded where not otherwise connected to the grounding electrode system.
  • Service equipment bonding (250.92): Non-current-carrying metal parts of service equipment enclosures shall be effectively bonded — requires bonding bushing or bonding locknut where concentric/eccentric knockouts are used.
  • Main bonding jumper (250.28): Required connection between neutral conductor and equipment grounding conductor at the service disconnecting means. Must not be re-installed at sub-panels (use separate neutral and ground bars).

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